The abstract is read at the publisher; the summary is JClub's.
Leakage current across monolayer hexagonal boron nitride (hBN) is higher than across monolayer MoS2 and WS2 because its thickness is about 50% lower, despite hBN’s nearly three-times larger bandgap.
- Why it matters: Ultrascaled electronics using two-dimensional materials need reliable leakage-current behavior, but how thickness, defects, and electrode roughness shape it is not well understood.
- What they did: They measured leakage current for hBN, MoS2, and WS2 at nanoscale and device level across different thicknesses, compared with industrial SiO2/n++Si, and used TCAD modeling plus density functional theory.
- The result: They found bottom-electrode surface roughness strongly changes leakage current under applied electric field, bandgap and defect density govern multilayers, thickness (electrode-to-electrode distance) dominates monolayers, and hBN leakage is equivalent to SiO2 films of different thicknesses for predicting device performance and reliability.
The findingWhy it mattersWhat they didThe result
AI summary of the abstract · may contain errors · not medical advice · read the paper.